发明名称 RCC FOIL USED IN PRINTED CIRCUIT BOARD
摘要 PURPOSE: An RCC(resin coated copper) foil is provided to prevent upper and lower RCC foils from being adhered with each other by preventing an overflow of a colloid during colloid compression process. CONSTITUTION: An RCC(10) is arranged on a printed circuit board(21) which is made of an insulating material. The RCC includes a piece type main body(11) having a size at least same as the size of the printed circuit board. A colloid(19) is coated flat on the joint surface between the piece type main body and one surface of the printed circuit board. The coated colloid is smaller than the printed circuit board. The printed circuit board covers the area coated with the colloid when the piece type main body is attached to the printed circuit board.
申请公布号 KR20040006545(A) 申请公布日期 2004.01.24
申请号 KR20020040845 申请日期 2002.07.12
申请人 ULTRATERA CORPORATION 发明人 YU CHING I;CHIH LANG CHING;LIU KANG TSUN;YEN KUNG MING
分类号 H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/00
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