发明名称 |
RCC FOIL USED IN PRINTED CIRCUIT BOARD |
摘要 |
PURPOSE: An RCC(resin coated copper) foil is provided to prevent upper and lower RCC foils from being adhered with each other by preventing an overflow of a colloid during colloid compression process. CONSTITUTION: An RCC(10) is arranged on a printed circuit board(21) which is made of an insulating material. The RCC includes a piece type main body(11) having a size at least same as the size of the printed circuit board. A colloid(19) is coated flat on the joint surface between the piece type main body and one surface of the printed circuit board. The coated colloid is smaller than the printed circuit board. The printed circuit board covers the area coated with the colloid when the piece type main body is attached to the printed circuit board.
|
申请公布号 |
KR20040006545(A) |
申请公布日期 |
2004.01.24 |
申请号 |
KR20020040845 |
申请日期 |
2002.07.12 |
申请人 |
ULTRATERA CORPORATION |
发明人 |
YU CHING I;CHIH LANG CHING;LIU KANG TSUN;YEN KUNG MING |
分类号 |
H05K3/00;(IPC1-7):H05K3/00 |
主分类号 |
H05K3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|