| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for heat-resistant printed wiring which can relax mechanical stress due to a difference between the thermal expansion coefficient of the substrate and that of an electronic component mounted on the same. SOLUTION: The substrate for printed wiring is constituted of an insulation layer 11 and a wiring conductor 13 while the surface of the insulation layer 11 for mounting the electronic components 201, 203 is formed into a recessed and projected shape 15. The recess and projection of the surface of the insulation layer open or close following the expansion or the contraction of the electronic components 201, 203, whereby thermal stress is relaxed. COPYRIGHT: (C)2004,JPO
|
