Semiconductor module comprises a semiconductor component provided on a region of a multiple layer substrate which is formed in a partial region as a micro-cooler through which coolant passes

摘要

Semiconductor module comprises a semiconductor component (7) provided on a region (11') of a multiple layer substrate (2) which is formed in a partial region as a micro-cooler through which coolant passes and has connections (17, 18) for introducing and removing the coolant. The semiconductor component is separated from the coolant connections in a hermetically sealed chamber.