| 摘要 |
In accordance with one aspect of the present invention, a process for forming a specific reactive element barrier on a titanium and aluminum containing substrate is provided. The process includes creating a dry air atmosphere with a concentration of water vapor below about 750 ppm at a temperature above about 550° C. contiguous to a surface of the substrate on which the barrier layer is to be formed. The temperature is maintained above 550° C. and the water vapor concentration is maintained below about 100 ppm while the water vapor in the dry air atmosphere is reacted with specific reactive elements at the substrate surface. The reaction forms a specific reactive element oxide barrier layer which is strongly bonded to the substrate surface. The barrier layer includes an aluminum oxide layer at the substrate/barrier layer interface and a second oxide layer at a barrier layer/atmosphere interface.
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