发明名称 RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To obtain a resin composition for a reversible heat-sensitive recording material extending the erasion energy range for erasing an image with thermal energy of a thermal head, facilitating the erasion of the image, erasing the image even with the initial erasability after forming the image, erasing the image under erasing conditions corresponding to the initial erasing characteristics without adversely affecting the environment during incineration and having repetition durability of image formation and erasion even when preserved over a long period after forming the image. <P>SOLUTION: This resin composition is obtained by dispersing an organic low-molecular substance in a resin base material and is used as the resin base material for the reversible heat-sensitive recording material having a heat-sensitive layer changing the transparency depending on temperature on a support. The resin composition is composed of (A) an acrylic copolymer having 30-60&deg;C glass transition temperature (Tg) determined from the Fox formula, 20-130 mg KOH/g hydroxy value (OHV) and 20,000-100,000 weight-average molecular weight (MW) and (B) a polyisocyanate. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004010630(A) 申请公布日期 2004.01.15
申请号 JP20020161711 申请日期 2002.06.03
申请人 RICOH CO LTD;MITSUBISHI RAYON CO LTD 发明人 SAKATA RYOKO;HOTTA YOSHIHIKO;KUBOYAMA HIRONORI;IKEGAMI YUKIHIRO;NAKAMURA SUEO
分类号 B41M5/36;C08G18/62 主分类号 B41M5/36
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