发明名称 |
Semiconductor device having a built-in contact-type sensor |
摘要 |
<p>A semiconductor element provided in a semiconductor device includes a built-in contact-type sensor having a sensor area formed on a circuit formation surface. Connection terminals are provided in an area other than the sensor area. A wiring board is connected to the connection terminals of the semiconductor element so that an end surface of the wiring board is positioned on the circuit formation surface. A protective resin part covers a part extending from the end surface of the wiring board to the circuit formation surface so as to protect a connection portion between the semiconductor element and the wiring board.</p> |
申请公布号 |
EP1380985(A2) |
申请公布日期 |
2004.01.14 |
申请号 |
EP20030013875 |
申请日期 |
2003.06.19 |
申请人 |
FUJITSU LIMITED |
发明人 |
HONDA, TOSHIYUKI |
分类号 |
G06K9/00;H01L21/60;H01L23/28;(IPC1-7):G06K9/20;H05K13/00 |
主分类号 |
G06K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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