| 摘要 |
A device for integrally joining a metal block (11') that can consist of a number of plates, by hard-soldering or brazing. The hard-solder provides a connection covering a large surface and with a minimal thickness in solder gaps (17j; j=1, 2, . . . , n-1) located between adjacent segment plates (12i; i=1, 2, . . . , n). At least one capillary solder inflow path (14) is provided. Said solder inflow path starts at a solder depot containing a supply of hard solder or braze material (42), which melts as the stack (11) of plates is heated. The melted solder material flows directly to the individual, also capillary solder gaps (17j; j=1, 2, . . . , n-1) via said solder inflow path, the solder gaps being provided between surfaces of the segment plates (12i) that face towards each other.
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