| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent resolution, adhesion properties and imaging properties, a photosensitive element, a method for manufacturing resist patterns, and a method for manufacturing a printed wiring board. <P>SOLUTION: The method for manufacturing resist patterns comprises coating the surface of a support with a photosensitive resin composition containing a carboxyl group-containing binder polymer containing 0.1 to 30wt% styrene or styrene derivatives as a copolymerization component, a photopolymerizable unsaturated compound (B), a photopolymerization initiator (C), and a general formula (1)(D), then drying the coating, laminating the same to form a photosensitive resin, laminating such photosensitive element on a substrate for circuit formation, irradiating the element with active rays in the shape of an image, and removing unexposed sections by development. <P>COPYRIGHT: (C)2004,JPO |
