| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board for mounting a semiconductor integrated circuit wherein a large number of decoupling capacitors are arranged in the vicinity of pads for connecting a power source/ground and can be connected in a short distance, and to provide a mounted circuit using the printed wiring board. SOLUTION: On a mounting surface 44A of the semiconductor integrated circuit 43 of the printed wiring board 44, wiring patterns 23, 24 are formed from a pad 22 for connection on a first row from the inside, to the inside and connected with a viahole 27. Patterns 3, 4 are formed from a pad 1 for connection on a second row from the inside, to the outside and connected with viaholes 5, 7. On an opposite surface 44B, a decoupling capacitor 13 is mounted between the viahole 27 connected with the pad 22 for connection on a first row from the inside and the viahole 5 connected with the pad 1 for connection on a second row from the inside. COPYRIGHT: (C)2004,JPO
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