发明名称 Single and multilevel rework
摘要 A method of reworking BEOL (back end of a processing line) metallization levels of damascene metallurgy comprises forming a plurality of BEOL metallization levels over a substrate, forming line and via portions in the BEOL metallization levels, selectively removing at least one of the BEOL metallization levels to expose the line and via portions, and replacing the removed BEOL metallization levels with at least one new BEOL metallization level, wherein the BEOL metallization levels comprise a first dielectric layer and a second dielectric layer, and wherein the first dielectric layer comprising a lower dielectric constant material than the second dielectric layer.
申请公布号 US6674168(B1) 申请公布日期 2004.01.06
申请号 US20030248452 申请日期 2003.01.21
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 COONEY, III EDWARD C.;GEFFKEN ROBERT M;MCGAHAY VINCENT J;MOTSIFF WILLIAM T.;MURRAY MARK P.;PIPER AMANDA L.;STAMPER ANTHONY K.;THOMAS DAVID C.;TYBERG CHRISTY S.;WEBSTER ELIZABETH T.
分类号 H01L21/3205;H01L21/768;H01L21/82;H01L23/52;H01L23/522;H01L23/525;H01L23/532;(IPC1-7):H01L21/00;H01L23/48 主分类号 H01L21/3205
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