Dreidimensionaler Mehrchipmodul

摘要

The invention relates to a 3D multichip module including a plurality of two-dimensional elementary electronic modules (4a-4d) each comprising at least one chip (10a-10d), a support (6a-6d) on which the chip is arranged and a conductor interconnection network (8a-8d) covering an upper surface of the support. These elementary modules are arranged substantially on one another in an offset way (in a staircase) and connected to one another by means of their interconnection networks and connection lands (12a-12d) arranged on the parts of the elementary modules which are not covered by the upper elementary module. Application to combining integrated circuits with microconnections.