Microelectronic substrate edge bead processing apparatus and method

摘要

Within an edge bead processing apparatus and an edge bead processing method, there is employed at least one of: (1) a nozzle suitable for directing a volume of fluid onto an annular edge ring of a substrate when received upon a platen, wherein the nozzle is geometrically configured to direct the volume of fluid simultaneously to all portions of the annular edge ring absent motion of the substrate with respect to the nozzle; and (2) a reflective optical apparatus suitable for directing a dose of radiation to the annular edge ring of the substrate when received upon the platen, wherein the reflective optical apparatus is geometrically configured to direct the dose of radiation to all portions of the annular edge ring absent movement of the substrate with respect to the reflective optical apparatus.