| 发明名称 |
MULTI-STACK SURFACE MOUNT LIGHT EMITTING DIODES |
| 摘要 |
A surface mount device light emitting diode package is provided. The package includes a circuit board housing attached to a printed circuit board. The circuit board housing supports a first light emitting diode and a second light emitting diode. The light emitting diodes are then coupled to the printed circuit board. |
| 申请公布号 |
WO03028103(A3) |
申请公布日期 |
2003.12.18 |
| 申请号 |
WO2002US26179 |
申请日期 |
2002.08.16 |
| 申请人 |
INTEL CORPORATION |
发明人 |
RINALDI, JARETT, L.;BOYD, PATRICK;LAVALLE, ALAN |
| 分类号 |
H01L25/075;H01L33/48;H05K3/34 |
主分类号 |
H01L25/075 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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