| 摘要 |
<p>In the invention, there is provided an apparatus for mounting electronic components in which one or a plurality of mounting heads (7) pick up electronic components (24) from a plurality of component feeding units (3) for mounting the electronic components on a print circuit board, with assured pick-up and holding of the electronic components (24). <??>The component feeding units (3) do not always have an identical pick-up position (10) among all the units (3) used in a mounting operation because of the variation in the manufacturing and the mounting of the units. The shift due to the variation along the direction of feeding, the Y direction, is corrected by moving the position of the nozzle (21) along the Y direction preferably with a controlled rotation of the mounting head (7) around an horizontal axis using the nozzle selection motor (22) for selecting the nozzle (21). <IMAGE></p> |
