| 摘要 |
PROBLEM TO BE SOLVED: To provide a wave soldering apparatus capable of effectively separating the oxide to prevent the oxide from sticking to a substrate. SOLUTION: A jet box 10 is installed in a solder tank 2 in which a molten solder W is pooled. A duct part 15 is provided with a pump 7 which feeds the molten solder sucked from a sucking port 16 to a storage chamber 11. A flow guide path 20 horizontally extends from the upper part of the reservoir 11 and then folds back to form an upper path 22 which is provided with a separating plate 35 composed of a horizontal wall 36 and a vertical wall 37. The molten solder flowing the upper path 22 is separated into an upper layer and a lower layer by the horizontal wall 36. The upper layer where oxide gathers drops to the solder tank 2 from a notch 32 of a side wall 30. Only the molten solder of the lower layer from which the oxide is removed is guided to a nozzle part 28 on a flow guiding plate 24, and is supplied to a substrate K. COPYRIGHT: (C)2004,JPO |
