SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device using a land or a metallic bump as an external terminal capable of easily and surely disposing wiring with high density to be connected to the external terminal without deteriorating mounting reliability.

SOLUTION: A basic land 17A and a pair of compact lands constituted of a compact land 17B and an auxiliary land 17C are formed through an insulating resin film 14 on the main surface of a semiconductor chip 11. The basic land 17A and the compact land 17B are connected through metallic wiring 18 to an element electrode 12, and connected through an opening of a solder resist film 19 to a metallic bump 20. A part of the metallic wiring 18 is disposed in a region between the pair of compact lands so as to be insulated by the solder resist film 19, and the metallic bump 20 formed on the compact land 17B is connected to the auxiliary land 17C across the upper side of the metallic wiring 18 positioned between the pair of compact lands.

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