| 摘要 |
<p>A probe system for providing signal paths between an integrated circuit (IC) tester (52) and input/output, power and ground pads (54) on the surfaces of ICs (56) to be tested includes a probe board assembly (50), a flex cable (86) and a set of probes (80) arranged to contact the IC's I/O pads (54). The probe board assembly (50) includes one or more rigid substrate layers (60, 62, 64) with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester (52) to probes (80) accessing some of the IC's pads (54). The flex cable (86) provides relatively high bandwidth signal paths linking the tester (52) to probes (80) accessing others of the IC's pads (54). A flex strip may alternatively be disposed behind a substrate with probes.</p> |
