摘要 |
The sensor unit (14) has a number of individual sensors (10) embedded in an input surface (12), with a conductor path structure on the underside of the input surface, for detecting the signals from the individual sensors. The conductor path structure lies in at least 3 successive conductor path layers, divided into regions containing a number of sensors, with the signals from all sensors in the region coupled to a common conductor path for providing a sensor group. An evaluation device coupled to the sensor unit combines the individual sensors for corresponding regions of different layers to provide a logic unit (26).
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