| 摘要 |
PROBLEM TO BE SOLVED: To enhance analytical precision, to reduce the size of a device, and to allow simplification of control or the like. SOLUTION: In this pretreatment method for wafer inspection having a liquid dropping process for dropping a hydrofluoric acid solution on a surface of a silicon wafer W of an inspection object, a liquid collecting process for dissolving a natural oxide film or the like on the surface of the silicon wafer W by the dropped liquid drop to be taken in, and a recovery process for recovering the taken-in liquid drop as a sample for measuring a degree of contamination from the wafer, a common nozzle 2 is used as a nozzle for sucking up the hydrofluoric acid solution used in the liquid dropping process from a container to be dropped on the surface of the silicon wafer, a nozzle for capturing the dropped liquid drop to scan the surface of the silicon wafer, and a nozzle for suction-recovering the liquid drop after the scan as an analyzing sample, the common nozzle 2 is automatically moved to the respective processes under the condition where the nozzle 2 is supported by a nozzle holding and moving mechanism 4, and the nozzle 2 is replaced with a new common nozzle in every silicon wafer of the inspection object. COPYRIGHT: (C)2004,JPO
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