| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting structure of a highly reliable high frequency module which does not cause the peel of a soldered portion. <P>SOLUTION: In the mounting structure of the high frequency module, reinforcing electrodes 6 are provided for increasing mounting strength at the lower surface of a circuit board 1 in a state that a plurality of electrodes are provided adjacently to first and second electrode groups 4a, 4b. Moreover, reinforcing lands 14 corresponding to the reinforcing electrodes 6 are provided to a mother board 11 in adjacent to a land 13. The electrode 3 and the land 13, and the reinforcing electrodes 6 and a reinforcing land 14 are soldered, respectively. Accordingly, the soldering of the high frequency module to the mother board can be strengthened to ensure higher reliability. <P>COPYRIGHT: (C)2004,JPO</p> |
