发明名称 INK JET PRINT HEAD, METHOD FOR BONDING FPC CABLE OF INK JET PRINT HEAD, AND APPARATUS HAVING THE SAME
摘要 PURPOSE: An ink jet print head, a method for bonding an FPC cable of the ink jet print head and an apparatus having the same are provided to reduce a manufacturing time for the ink jet print head by shortening a bonding time of a conductor. CONSTITUTION: A substrate for an ink jet print head including resistance heaters, signal lines connected to the resistance heaters, and electric pads for connecting the signal lines to an external device is provided(91). Then, an FPC cable having a plurality of conductors is prepared(92). The conductors are formed with bonding sections corresponding to the pads. Then, a thermal-pressure type bonding device having a bonding tool is provided so as to heat the bonding sections in a state that the bonding sections are pressed on the pads of the substrate(93). The substrate is mounted on a stage(94). Then, bonding sections of the conductor are aligned corresponding to the pads. Then, the conductor is heated by using the bonding tool(96).
申请公布号 KR20030089939(A) 申请公布日期 2003.11.28
申请号 KR20020027867 申请日期 2002.05.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO, SEO HYEON;JUNG, MYEONG SONG;KANG, SA YUN;KIM, JEONG SEON;SON, DAE U
分类号 B41J2/16;B41J2/045;B41J2/055;B41J2/14;H05K1/14;H05K3/32;H05K3/36;(IPC1-7):B41J2/16 主分类号 B41J2/16
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