Method and apparatus for attaching polishing cloths to the plates of a polishing machine such as for polishing silicon wafers using grooves or ridges to control application of a vacuum

摘要

The apparatus comprises a lens shaped gas tight cushion or bellows with a valve for applying pressure to the cushion. The outer surface of the cushion has at least a region whose outer diameter is slightly smaller than that of a film or cloth which is to be stretched across the cushion. This part of the outer surface has a system of connected ridges or grooves via which the film can be held by vacuum suction. The method involves positioning two polishing cloths on either side of the cushion and positioning the cushion between the two plates of the machine. The upper plate is then lowered such that the self adhesive upper sides of the cloths contact the plates. The upper plate is then further lowered such that the cushion is compressed and the cloths adhere to the plates. The plate can then be lifted with the attached cloths and the cushion removed.