发明名称 |
Method for preparing composite materials of a positive temperature coefficient thermistor |
摘要 |
The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal. Finally, a thermal-laminating process is performed to laminate a polymeric composite material on the composite electroplating layer to form the composite materials of the positive temperature coefficient thermistor device, wherein the polymeric composite material is conductive crystallized and filled with the carbon black.
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申请公布号 |
US2003217457(A1) |
申请公布日期 |
2003.11.27 |
申请号 |
US20030424144 |
申请日期 |
2003.04.25 |
申请人 |
PROTECTRONICS TECHNOLOGY CORPORATION |
发明人 |
HWANG REN-HAUR;LIU DER-YANG;LIN CHEN-RON |
分类号 |
C25D5/16;C25D15/02;H01C1/14;H01C7/02;H05K1/16;H05K3/38;H05K3/46;(IPC1-7):H01C17/00 |
主分类号 |
C25D5/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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