METHOD FOR MEASURING THICKNESS OF THIN FILM

摘要

PURPOSE: A method for measuring the thickness of a thin film is provided to be capable of measuring the thickness of the thin film in real time without the damage of the thin film. CONSTITUTION: After sequentially forming a lower layer patterned to a predetermined shape and an upper layer for enclosing the lower layer at the upper portion of a semiconductor substrate, a modeling process is carried out at the lower layer(500). Then, a thickness measuring process is carried out at the upper layer(510). Preferably, a predetermined material layer setting process is carried out at the lower layer and then, a fitting process is carried out at the predetermined material layer as the lower layer by using a harmonic oscillator model.