发明名称 |
High speed electronic interconnection using a detachable substrate |
摘要 |
Conductors to interconnect electronic devices, the conductors being formed on a detachable substrate. The substrate is aligned with a package containing electronic devices. The conductors are bonded to pads on the devices. Then, the substrate is detached. Each conductor is self supporting between the devices, has a two dimensional shape and has a surface that is substantially parallel to a surface of the pads.
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申请公布号 |
US2003213963(A1) |
申请公布日期 |
2003.11.20 |
申请号 |
US20020150303 |
申请日期 |
2002.05.17 |
申请人 |
LEMOFF BRIAN E.;BUCKMAN LISA A. |
发明人 |
LEMOFF BRIAN E.;BUCKMAN LISA A. |
分类号 |
H05K3/20;H01L21/60;H01L21/68;H01L25/075;H01L25/16;H01L31/02;H01L33/00;H05K1/14;H05K3/36;(IPC1-7):H01L33/00;H01L21/00;H01L27/15 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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