| 摘要 |
An electronic assembly including a die (40), having an integrated circuit formed therein, a thermally conductive heat spreader (16), and indium (14) located between the die and the heat spreader, is described. The heat spreader (16) has a layer of nickel (22). A gold layer (24) is formed on the nickel layer (22), and provides better wetting of indium than nickel. A better structural connection between the indium (14) and the heat spreader (16) is provided, especially during thermal cycling. |
