发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT, METHOD FOR MANUFACTURING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD BY USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition extremely excellent in adhesiveness and low tendency to scum. <P>SOLUTION: The photosensitive resin composition contains (A) a carboxyl group-containing binder polymer containing styrene or a styrene derivative as a copolymerized constituent, (B) a photopolymerization initiator, and (C) a compound expressed by general formula (I). In formula (I), R<SP>1</SP>represents a hydrogen atom or a methyl group, A represents a 2-6C alkyleneoxy group, Z<SP>1</SP>represents a halogen atom, alkyl group, cycloalkyl group, aryl group, amino group, alkylamino group, dialkylamino group, nitro group, cyano group, mercapto group, alkylmercapto group, allyl group, hydroxyalkyl group, carboxyalkyl group, acyl group, alkoxy group or a group having a heterocycle, m represents an integer 6 to 20 and n represents an integer 0 to 5. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003330189(A) 申请公布日期 2003.11.19
申请号 JP20030087152 申请日期 2003.03.27
申请人 HITACHI CHEM CO LTD 发明人 OHASHI TAKESHI;ISHIKAWA TSUTOMU
分类号 G03F7/033;G03F7/004;G03F7/027;G03F7/028;H05K3/06;H05K3/18 主分类号 G03F7/033
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