| 摘要 |
PROBLEM TO BE SOLVED: To adaptively fill a sealing compound with a proper amount corresponding to variations even if the variations occur in a gap between an electronic part and a substrate, thereby avoiding the problem of a defective external appearance and the problem of a malfunction. SOLUTION: A sealing compound filling device 20 comprises a measuring means 21 for measuring the surface height H<SB>1</SB>of an electronic part 26 and the surface height H<SB>2</SB>of a substrate 28 in a state that an electrode 27 of the electronic part 26 is connected to an electrode 29 of the substrate 28, and a control means 22 for controlling the amount of a sealing compound 2 to be filled in a gap Gap between the electronic part 26 and the substrate 28 based on the measured value. Since H<SB>1</SB>varies corresponding to the Gap, when the Gap is larger than a proper gap, the filling amount of the sealing compound 32 is controlled toward an increase, while, when the Gap is smaller than the proper gap, the filling amount of the sealing compound 32 is controlled toward a decrease, thereby filling the sealing compound 32 with the proper amount corresponding to variations of the Gap. COPYRIGHT: (C)2004,JPO
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