| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve grinding efficiency by using an integrated grinding with carrier particles and abrasive grains having a hydrophilic surface. <P>SOLUTION: The method uses, for example, the abrasive 105 which contains the carrier particles 103 and the abrasive grains 104 and a fatty acid such as oleic acid or the like which is not shown in the figure, in a liquor set≥5 cSt (23°C) of viscosity, in grinding a semiconductor substrate 102. The carrier particles 103 for example, comprise an organic polymer with 1-20μm of average particle size and the abrasive grains 104, for example comprise silicon carbide (SiC) of particle size close to 2μm. The liquor uses a base oil comprising a paraffinic mineral oil. <P>COPYRIGHT: (C)2004,JPO</p> |
