| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a flux collecting apparatus 53 to remove a flux element mixed in atmospheric gas 41 filling a reflow furnace 1 for soldering a circuit board 3 that the flux element of the atmospheric gas 41 returned is easily liquefied and adhered to a wall surface resulting in a requirement for a repeated heating process, because the flux collecting apparatus 53 cools the gas 41 in order to liquefy the flux element. SOLUTION: The flux collecting apparatus 53 is provided with an external heat exchanger 63 at the deeper area of a sending path 55 to guide the atmospheric gas from the reflow furnace 1 in order to liquify the flux element through heat exchange between the atmospheric gas 41 and external air. Moreover, an internal heat exchanger 75 is also provided in both sending path 55 and a returning path 57 for returning the liquified atmospheric gas. Accordingly, the adhesion of the flux element can be prevented by a heating process by the heat of the atmospheric gas itself. COPYRIGHT: (C)2004,JPO |
