| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a poliching device and a method capable of improving the application efficiency of a polishing solution and uniformly and effectively polishing a semiconductor wafer. <P>SOLUTION: The polishing device is provided with a polishing table to be rotated, polishing cloth 2 attached to the surface of the polishing table, a polishing solution supplying mechanism 6 for supplying the polishing solution 7 on the surface of the polishing cloth 2, a wafer holding mechanism 4 for holding the semiconductor wafer, and a guide member 9 having grooves 9a for passing the polishing solution 7 and guiding the polishing solution 7 to the inner area of the polishing table. <P>COPYRIGHT: (C)2004,JPO</p> |
