发明名称 |
Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device |
摘要 |
An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 mum or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 mum or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 muM or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.
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申请公布号 |
US2003211327(A1) |
申请公布日期 |
2003.11.13 |
申请号 |
US20030421696 |
申请日期 |
2003.04.24 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
USUI HIDEYUKI;OKUDA SATOSHI;NAKAO MINORU |
分类号 |
C08L9/00;C08G59/62;C08L63/00;C08L63/04;C08L83/08;H01L23/29;H01L23/31;(IPC1-7):B32B27/38 |
主分类号 |
C08L9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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