发明名称 METHOD FOR FILLING AND ADHERING TO WOOD PANEL
摘要 PROBLEM TO BE SOLVED: To provide a method for filling and adhering to a wood panel in excellent productivity, by which an adhesion-defective portion is not formed, because a filling and adhesive agent can be filled to all the corners of dent grooves formed on the back side of the wood panel, and the next process can be carried out after the filling process, because the filling and adhesive agent quickly exhibits an initial cohesive force. SOLUTION: This method for filling and adhering to the wood panel, comprising filling a moisture-curable heat-meltable resin to the dent grooves formed on the back side of the wood panel, is characterized in that the moisture-curable heat-meltable resin has a melt viscosity of≤10,000 mPa.s at 120°C and the relation of a melted volume (V120) at 120°C and a volume (V20) at 20°C satisfies the expression: (V120-V20)/V120<0.1. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003313513(A) 申请公布日期 2003.11.06
申请号 JP20020121177 申请日期 2002.04.23
申请人 SEKISUI CHEM CO LTD 发明人 KUDO KAZUSUKE
分类号 C09J5/00;C09J201/00;(IPC1-7):C09J5/00 主分类号 C09J5/00
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