| 摘要 |
PURPOSE: A semiconductor package is provided to be capable of simplifying the design of a PCB(Printed Circuit Board) and improving the reliability of a semiconductor package by efficiently installing a heat sink. CONSTITUTION: A semiconductor package is provided with a semiconductor chip, a lead frame attached with the semiconductor chip, an encapsulating part for selectively sealing the resultant structure. At this time, a plurality of leads are connected to the lead frame. At the time, some parts of the leads are used as a signal terminal and the other parts of the leads are used as a heat sink for releasing the heat generated from the semiconductor chip. Preferably, the leads for the signal terminal are mainly located at one out of two long lateral portions and the heat releasing leads are located at the other.
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