| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element storing package excellent in its transmission efficiency for high-frequency signals. SOLUTION: The semiconductor element storing package has a substrate 1 having a mounting portion 1a for mounting a semiconductor element 5 on its upper-side principal surface, and has a frame 2 so joined to the outer periphery of the upper-side principal surface of the substrate 1 as to surround the mounting portion 1a in whose side portion a through hole 2b is formed, and further, has a coaxial connector 3 comprising a cylindrical outer peripheral conductor 3a and a central conductor 3b which are inserted engagingly into the through hole 2b and joined thereto, and an insulator 3c interposed between the conductors 3a, 3b. In the coaxial conductor 3, there is formed at the opposite end of an outer peripheral conductor 3a to the outer side of the frame 2 a nearly circular flange 3d wherein the flat surface 3e of a portion of its outer peripheral surface is formed, and there is formed a thin-walled portion 3f having its flattened upper-side surface formed at the end of the central conductor 3b which is present on the side of the mounting portion 1a. Further, there is formed a step portion 2e having the through hole 2b with the flange portion 3d engaged with the opening of the outer-surface side of the frame 2. COPYRIGHT: (C)2004,JPO |
