| 摘要 |
<p>The present invention provides an apparatus and method for protecting a work piece during surface processing. The apparatus employs a protective material (22) to protect a wafer during backside grinding. The apparatus can further include a vacuum chuck (14) that allows the passage of a vacuum signal, a frame (24) holding the protective material, a frame holder (26) to hold the frame, and a fastening arrangement to fasten the frame holder to the chuck adjacent a support surface. The method can include providing a vacuum chuck, placing a protective material in contact with the chuck, placing a wafer in contact with the protective material, applying a vacuum signal securing the wafer with the chuck, and grinding the backside surface of the wafer.</p> |
