| 摘要 |
PROBLEM TO BE SOLVED: To prevent the matching position of an optical semiconductor element with an optical fiber from being affected by longitudinal bending, and to improve the transmitting characteristics of a high frequency signal by shortening a bonding wire connected with a lead terminal. SOLUTION: This package for housing an optical semiconductor element is provided with an almost rectangular substrate 1 having a placing part 1a on whose upper face an optical semiconductor element 4 is placed and an almost rectangular frame body 2 connected with the substrate 1 so that the placing part 1a can be surrounded. In this case, screw parts 15 are arranged on the both short sides of the substrate 1, and an optical fiber fixing member 8 is arranged on one longitudinal side part of the frame body 2, and a lead terminal member 7 is arranged on the other longitudinal side part. |
