| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a heat conductive substrate on which a conductor for circuit formation can surely be positioned. SOLUTION: In a method for laminating a sheet-shaped thermo-setting resin component which is flexible in a half or partially hardened state and the conductor for circuit information and thereafter heating and pressurizing them within a metallic mold for integrating the conductor for circuit formation and the sheet-shaped thermo-setting resin component, the conductor for circuit formation 2 is fixed to the metallic mold by adsorption and thereafter the connection crosspiece 5 of a floating island 6 is cut out. Then, formation is performed in the state of positioning the floating island 6 by vacuum adsorption as it is, otherwise formation is performed in a state where the crosspiece 5 is fitted, thereafter the crosspiece 5 is removed. COPYRIGHT: (C)2004,JPO |
