| 摘要 |
PROBLEM TO BE SOLVED: To form an electronic component mounting substrate with high reliability and its sealing structure by removing protrusion of an adhesive of a cap for sealing an electronic component. SOLUTION: The electronic component mounting substrate 9 where a conductor circuit 7 is formed on a surface of an insulating substrate has an electronic component mounting section 8 for mounting the electronic component 2 electrically connecting to the conductor circuit 7. In the electronic component mounting substrate, the flow of the adhesive 6 for the cap 5 which seals the electronic component 2 is eliminated by forming one or a plurality of grooves 1 on an insulating layer section 3 that is on the close periphery of the mounting section 8 and where the conductor circuit 7 does not exists, thereby the electronic component mounting substrate 9 with high reliability and an electronic component mounting device 10 are provided. The electronic component 2 is connected with the conductor circuit 7 by bonding wires 4. COPYRIGHT: (C)2004,JPO
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