| 摘要 |
PROBLEM TO BE SOLVED: To obtain a printed circuit board capable of excellently achieving the heat dissipation of heating electronic parts at a desired position. SOLUTION: Heat dissipating conductor patterns 11a, 11b are correspondingly provided on the surface and the back surface of a body of a printed circuit board 10 at a desired position, and the patterns 11a, 11b are connected mutually thermally through a heat conductive member 12 penetrating the printed circuit board 10. COPYRIGHT: (C)2004,JPO
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