| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package which includes a substrate having a high thermal conductivity and where this substrate is never bent to an unallowable degree in the case of connection process with a frame to avoid separation or other defects. <P>SOLUTION: The package constituted as a composed part is provided with: at least one substrate having a base bottom and a connecting surface; at least one semiconductor part; and at least one frame. The substrate, the semiconductor part and the frame are connected to each other, and the substrate of a mono or multi layer has a heat conductivity≥170 W/mK in a direction vertical to the connecting surface for exhausting heat. In the case of the multilayer, a layer adjacent to the semiconductor part is made of material having a modulus of elasticity≤750 GPa. The substrate has transition structure of layer structure and/or material composition and has asymmetrical thermal expansion characteristics where the thermal expansion modulus of a connecting surface is different from the thermal expansion modulus of the base bottom surface at least by 2%. <P>COPYRIGHT: (C)2004,JPO</p> |
