发明名称 Soldering iron with heated gas flow
摘要 It is an object to provide a solder iron such that in the solder iron for blowing out a heating gas flow to a periphery of a forward end tip, the heating gas flow having stable temperature is generated. A nozzle section is provided to a forward end tip heated by heating means of a solder iron main body, an orifice section is formed between a heating gas flow generating chamber and the nozzle section, and a back pressure of thermally expanded heating gas and a pressure of gas successively supplied are balanced in the heating gas flow generating chamber.</PTEXT>
申请公布号 US6633021(B2) 申请公布日期 2003.10.14
申请号 US20010000797 申请日期 2001.12.04
申请人 MATUBARA KENSEI 发明人 MATUBARA KENSEI
分类号 B23K1/012;B23K1/018;B23K3/02;B23K3/03;B23K3/047;B23K31/02;H05K3/34;(IPC1-7):B23K3/00 主分类号 B23K1/012
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