发明名称 MOLD DEVICE FOR MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a mold device for molding which can mold a molding by uniforming a thickness. SOLUTION: In a movable mold 2, a core block 46 is fitted to a movable side receiving plate 42. In a fixed mold 1, a cavity block 17 is fitted to a fixed side fitting plate 7. An air ejection cavity insert 62 is fitted to the axial center Z of the core block 46 through steps 61A and 62A. A clearance L formed between the fitting plate 42 corresponding to the space between the axial center side 3A of the product cavity 3 and its peripheral side 3B and the core block 46. Even when a resin flows into the product cavity 3 to expand the vicinity of the axial center Z in the product cavity 3, the expansion is prevented by the fitting of the steps 61A and 62A. On the axial center side 3A of the product cavity, the core block 46 retreats toward the clearance L by the pressure of the resin to increase the distance of the product cavity in the place. The thickness of the molding can be equalized by forming the distance of the axial center side 3A and the distance of the peripheral side in the product cavity 3 to be the same. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003291179(A) 申请公布日期 2003.10.14
申请号 JP20020097679 申请日期 2002.03.29
申请人 MITSUBISHI MATERIALS CORP 发明人 KAYAHARA TOSHIHIRO;TANO KAZUO
分类号 B29C45/26;G11B7/26;(IPC1-7):B29C45/26 主分类号 B29C45/26
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