| 摘要 |
PROBLEM TO BE SOLVED: To obtain a higher capacity in both a chip multilayer solid electrolytic capacitor and a chip multilayer nonpolar capacitor, to provide a smaller chip multilayer capacitor where a plurality of capacitor elements are easily sealed in a single package at the same time, and to provide a multi-terminal chip multilayer capacitor for lower inductance at a high frequency. SOLUTION: A valve metal electrode in a chip multilayer solid electrolytic capacitor and an internal electrode in a chip multilayer capacitor are plate-like bodies or foil-like bodies. They have such shapes that one to three corners among four corners of a square or rectangle are out off in a top view. Electrode leads of the chip multilayer capacitor are provided to one or a plurality of remaining corners. COPYRIGHT: (C)2004,JPO
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