发明名称 |
PACKAGING MICROELECTROMECHANICAL SYSTEMS |
摘要 |
A packaged microelectromechanical system (18) may be formed in a hermetic cavity (22) by forming the system (18) on a semiconductor structure (12) and covering the system with a thermally decomposing film (25). That film (25) may then be covered by a sealing cover (20). Subsequently, the thermally decomposing material (25) may be decomposed, forming a cavity (22), which can then be sealed to hermetically enclose the system (18). |
申请公布号 |
WO03082732(A2) |
申请公布日期 |
2003.10.09 |
申请号 |
WO2003US03692 |
申请日期 |
2003.02.05 |
申请人 |
INTEL CORPORATION |
发明人 |
HECK, JOHN;BERRY, MICHELE;WONG, DANIEL;RAO, VALLURI |
分类号 |
B81B3/00;B81B7/00;H01L23/31 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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