发明名称 LASER BEAM MACHINING METHOD AND MACHINING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method which can reduce a deviation amount of a hole. <P>SOLUTION: A work object in which a plurality of unit regions arranged in a matrix state are patterned on the surface and a plurality of machining spots are patterned in each unit region is prepared. A hole is formed by scanning the laser beam after selecting one unit region from a plurality of the unit regions and by making the laser beam incident on a plurality of the machining spots in the unit regions. The holes are formed at the machining spots in all the unit regions by repeating the process. At this time, a plurality of the unit regions are selected in turn so as not to successively select the unit regions adjacent in a column direction or in a row direction. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003285177(A) 申请公布日期 2003.10.07
申请号 JP20020085437 申请日期 2002.03.26
申请人 SUMITOMO HEAVY IND LTD 发明人 HAMADA SHIRO
分类号 B23K26/00;B23K26/08;B23K26/38;B23K101/40;H05K3/00;(IPC1-7):B23K26/00 主分类号 B23K26/00
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