发明名称 |
Electronic package with thermally conductive standoff |
摘要 |
A heat dissipating flexible or resilient standoff is mechanically clamped between an electronic module and substrate, such as, PCB. The clamping arrangement comprises a heat sink compressing a thermally conductive flexible interface pad over the upper surface of the electronic module by way of mechanical linkage to the PCB. The heat dissipating flexible standoff provides a force opposing the compression force to thereby reduce stress on solder ball connections between electronic module and PCB. Thermally conductive flexible standoffs in the form of spring arrangements, such as a wire mesh, act to provide heat dissipation by both thermal conduction and thermal convection. A thermally conductive flexible polymer pad and a layer of porous metal foam may also act as thermally conductive standoffs.
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申请公布号 |
US6631078(B2) |
申请公布日期 |
2003.10.07 |
申请号 |
US20020044204 |
申请日期 |
2002.01.10 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ALCOE DAVID J.;CALMIDI VARAPRASAD VENKATA;DARBHA KRISHNA;SATHE SANJEEV BALWANT |
分类号 |
H01L23/373;H01L23/40;H01L23/42;H01R12/04;H05K1/02;H05K3/30;H05K3/34;H05K7/10;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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