| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board of multiple allocation on which metallized wiring conductors, outside connecting metallized layers, and sealing metallized layers of wiring board areas arranged on a ceramic mother substrate can be coated with plated metallic layers by electroplating. <P>SOLUTION: In the central part of the ceramic mother substrate 1, a number of wiring board areas 2, each of which has a recess 2a for housing an electronic component on its upper surface, and at the same time, to each of which metallized wiring conductors 6 led out to corners of the outer periphery of the recess 2a from the bottom face of the section 2a and a sealing metallized layer 7 surrounding the recess 21 are adhered, and arranged longitudinally and transversally. In addition, through holes 4 the internal surfaces of which are coated with the outside connecting metallized layers 8 electrically connected to the wiring conductors 6 are formed at the intersections of the boundary lines dividing the wiring board areas 2. The diagonally faced two of the sealing metallized layers 7 and the outside connecting metallized layers 8 at each wiring board area 2 are electrically connected to each other. <P>COPYRIGHT: (C)2004,JPO |
