| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for housing a semiconductor element that can radiate heat generated when the housed semiconductor element operates into the atmosphere. <P>SOLUTION: This package is composed of an insulating substrate 1 having a recess 1a in which the semiconductor element 3 is loaded and housed and wiring conductors 6 led out from the recess 1a to the external surface of the substrate 6 on its upper surface and a cap 2. The semiconductor element 3 is airtightly housed in the recess 1a of the substrate 1. In the substrate 1, a plurality of through metal layers 8 are formed from the bottom face of the recessed section 1a toward the lower surface of the substrate 1. The cross-sectional area of each metallic layer 8 gradually increases as going toward the lower surface of the substrate 1 from the bottom face toward the recess 1a. In addition, the bottom face of the section 1a is coated with a netlike heat transferring layer 9 composed of a heat transferable composition and connecting exposed ends of the metal layers 8 to each other. <P>COPYRIGHT: (C)2004,JPO</p> |
