HIGH-PRESSURE SUBSTRATE TREATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a high-pressure substrate treating apparatus that is small- sized and capable of performing a series of substrate treatments from development to drying with a superior throughput and at a low cost. SOLUTION: An upper lid 13 can be moved in the upward and downward directions to a vessel body 12. When the upper lid 13 is raised, the upper lid 13 separates from the vessel body 12 upwardly to permit a substrate W to be conveyed in/from a spin chuck 41. Moreover, a developing nozzle 61 can move between the exterior of a pressure vessel 1 and the upper location of the substrate W that is held by the spin chuck 41 in this separated state. The developing nozzle 61 discharges a developer toward the surface of the substrate W from the tip of the nozzle while moving to the upper location of the substrate W so as to carry out development to the substrate W. The upper lid 13 is lowered to contact with the vessel body 12, and thereby a treatment chamber 11 is formed. By introducing an SCF there, high-pressure drying treatment to the substrate W is carried out. COPYRIGHT: (C)2004,JPO